Samsung’s Plan To Triple Chip Production
Samsung Electronics has announced plans to triple its semiconductor production capacity by 2026, as it moves to future-proof the company against further... Read More
Samsung Unleashes New Chip Packaging Technology
Samsung Electronics fired a shot at competitors yesterday, as it unleashed its new next-generation 2.5D packaging technology. Interposer-Cube4 (I-Cube4) is already available... Read More
Taiwan’s Drought Won’t Slow TSMC’s Chip Manufacturing
The largest contract chip manufacturer in the world, TSMC, is responding to Taiwan’s water shortage by building a plant that can treat... Read More