Reports out of Korean IT news website etnews claim that Qualcomm has teamed up with Taiwan’s TSMC instead of Samsung Electronics to build its next generation of Snapdragon chipsets.

In years past, Qualcomm has worked with the components arm of Samsung to produce their flagship product – found in many of the smartphone world’s most popular devices.

However, word is that the two companies are parting ways over a difference in chip-sizes with Qualcomm keen to move to 7mm but Samsung unable to meet the order.

Further reports by The Investor (via the Aju Business Daily) have suggested that this shift will see LG’s G7 be the first major smartphone to feature the new and improved hardware.

The new chipset, presumed to be called the Snapdragon 845, hasn’t been officially announced yet but is widely-expected to improve both efficiency and performance by 30% over this year’s Snapdragon 835.

“The adoption of the Snapdragon 845 for LG’s next flagship phone seems inevitable, considering the emerging virtual reality and augmented reality solutions require more powerful data processing capability,” an industry official told The Investor.